Kun Ying Electronic Technology Co., Ltd.,  a joint venture enterprise, is specializing in the production of single, double, multilayer PCB\/FPC (soft and hard combination plate and aluminum, ceramics, HDI blind buried orifice, Huilong plate, sheet, high carbon resistance, backplane, thick copper, high frequency circuit boards) joint venture company; founded in 1996 / 2002 / 2003 / 2005; located in Zhejiang, Ling'an, Guangdong's production base, the company's existing plant and office area of nearly 35000 square meters, the monthly capacity of double-sided board: 600000 square feet, multilayer board and HDI blind buried orifice: 780000 square feet, flexible plate to produce: 380000 square feet; the company has a for many years engaged in PCB production. We have advanced production equipment, technical team management experience for many years, the main products are widely used in communication terminal, communication station, communication electronics, computer, electrical, SD card, SG card, automotive, financial, medical, aerospace, aviation, LED, computer, military products, soft board products for notebook computer, LCD, CD-ROM, hard disk, printer, fax machines, scanners, sensors, mobile phone, mobile phone battery, interphone, mobile phone antenna, mobile phone card, mobile phone cable, all kinds of high-grade camera, digital camera, Digital camera, video tape recorder, laser head, CD-ROM, VCD, CD, DVD, medical equipment, instrumentation, automotive instrumentation, light bar, FPC, collar, lighting, power supply aluminum plate, copper substrate, electronic assembly field. And equipped with modern information technology improve IE, ERP management system, service system of production equipment and after sales advanced service for you!
浙江坤蓥电子科技有限公司是一家合资控股企业，**生产单、双面、多层PCB/FPC(软硬结合板及铝基、陶瓷、HDI盲埋孔板、汇龙板、**薄板、高碳阻、背板、厚铜板、高频电路板等)合资企业;公司分别创立于1996 / 2002 / 2003 / 2005年;位于浙江临安，广东多家生产基地，公司现有厂房及办公面积近35000平米,月产能双面板:60万平方尺,多层板及HDI盲埋孔板:78万平方尺,柔性板月产:38万平方尺;公司拥有一支多年从事PCB生产.有先进的生产设备，多年经验管理的技术团队,主要产品广泛应用于通讯中端、通讯机站、通讯电子、计算机、电器、SD卡、SG卡、汽车、金融、航天、航空、医疗、LED、电脑、**产品、软板产品用于笔记本电脑、液晶显示器、光驱、硬盘、 打印机、传真机、扫描仪、传感器、 手机、手机电池、对讲机、手机天线、手机卡、手机排线,各种**照相机、数码相机、数码摄像机，录像机磁头、激光头、CD-ROM、VCD 、CD 、DVD、 医疗器械、仪表、汽车仪表、 光条、FPC 、项圈、灯饰、电源铝基板、铜基板等电子装配领域.并配有完善的现代科技信息化的IE,ERP管理体系,先进的生产设备及销售后服务体系为您服务！
线路板层数　                          1--36Layers　　　　　　	较小SMD间距                    6mils(0.15)
Min. SMD Space
较小线宽/线距(H/H )            3/3mils(0.075mm) Min. Trace/Space	较小SMD垫宽               3mils(0.075)
Min. SMD Land Width
较小线宽/距(1/1  2/2)  3/3mils(0.075mm)Trace/Space(1/1)	较大板尺寸       24''x36'' (533mmx860mm)  Max. Panel Size
较小孔径       4mils(0.1mm)
Min. Hole Size (Before Plating)	纵横比                                   8:1
Aspect Ratio
各层通孔对准度     3mils(0.075mm)
Registration Between Layers Tolerance	簿板能力                              8mils(0.05mm)
Min. Thickness Board
外层铜厚The outer layer of the copper thickness
0.03oz-12oz (9-420mil)
内层铜厚The inner layer copper thickness
0.03oz-6oz (9-200mil)	电金厚度Gold thickness：0.075-200u”
电镍厚度Nickel thickness:2-8um
沉金厚度ENIG thickness：0.075-40u”
电锡厚度Electric tin thickness：3-8um
防焊误差值       2.5mils(0.064mm)
Solder Mask Tolerance	厚板能力   200mils(5.0mm)
Max. Thickness Board
防焊条               3.0mils(0.075mm)
Min. Solder Dam	特性阻抗                                  ±5-10%Ω
Characteristic Impedance
成型尺寸度           +/-4mils(+/-0.1mm)
Outline Dimension Tolerance	其它客户特定要求
other